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Terms related to Conductive Paste
- ◆Ion Migration
- It is a phenomenon in which ions of a conductor metal migrate due to the influence of electricity flowing through the metal conductor, resulting in defects in the conductor section.
- ◆Firing
- This refers to heating ceramics, metals, etc. at high temperatures below their melting points to change their strength and properties.
- ◆Vehicle
- A liquid component that serves as a medium for evenly dispersing and adhering pigments and additives.
- ◆BBO(binder burn out)
- Abbreviation for Binder Burnout, which refers to the decomposition of the binder (organic content of the paste) by firing.
- ◆Peel strength
- It is the force (peeling strength) per unit area (width) that peels off the conductor pattern of a substrate, and is also referred to as peeling strength.
- ◆Pull Strength
- It is the force applied when an upward force is applied and pulled away from the substrate/die. The strength is measured by joining wires.
- ◆Conductive Adhesive
- As the name suggests, it is an adhesive with conductive properties. It is mainly used for bonding electronic components and chips. Compared to solder, it can be bonded at lower temperatures.
- ◆Silver Nanoparticles
- Silver in nanoparticle size. Normally, it is difficult for particles to exist as nanoparticles because the smaller they are, the more they aggregate, but our technology makes it possible to use them as nanoparticles.
- ◆Melting point depression phenomenon.
- It is a characteristic that the smaller the size of the metal particles, the lower the melting point. This is especially observed in nanoparticles with sizes of several tens of nanometers or less.
- ◆ESR
- Abbreviation for equivalent series resistance, which is the series resistance component present in a capacitor.
- ◆Active Metal Paste
- This is a metal paste containing active metals (Ti, Sn). Conventional metal pastes adhere to the substrate due to the glass component in the mixture, but this paste enables stronger adhesion by chemically bonding the active metal with the adherend (containing nitrogen).
- ◆Brazing
- This is a method of bonding by melting an alloy with a lower melting point than the object to be bonded by heating. Although this is essentially physical bonding, in the case of bonding active metal paste and nitrogen compounds, the chemical reaction that occurs during melting makes it possible to achieve stronger adhesion than physical bonding.
- ◆DBC
- Abbreviation for Direct Bonded Copper, a ceramic insulating substrate with a copper circuit.
- ◆AMB、AMC
- It is an abbreviation for AMB (Active Matal Brazing) and AMC (Active Metal brazed Copper). It refers to a substrate in which ceramics and a copper circuit board are bonded together via a brazing material.
- ◆Nitrogen Firing
- Firing is performed by filling the kiln with nitrogen. Generally, copper paste is fired in this way because copper is oxidized when fired in air.
- ◆Vulcanization resistance
- It refers to the resistance to sulfurization with sulfur components present in the air, etc. Copper is particularly resistant to sulfurization.
